Pob zeb diamond sib tsoo log: Daim ntawv qhia ua tiav rau cov yam ntxwv, thev naus laus zis, qhov zoo & kev siv

Dab tsi yog pob zeb diamond sib tsoo log?

Pob zeb diamond sib tsoo log yog cov cuab yeej abrasive uas muaj peb yam tseem ceeb:

Pob zeb diamond Abrasive Grain: Qhov nruab nrab txiav, ua los ntawm cov pob zeb diamond ntuj (tsis tshua muaj, tus nqi siab) lossis pob zeb diamond hluavtaws (ntau dua, engineered rau qhov sib xws). Synthetic pob zeb diamond nplej feem ntau coated (xws li, nrog npib tsib xee los yog titanium) los txhim kho adhesion rau daim ntawv cog lus thiab tiv thaiv hnav.
Bond Matrix: Tuav lub pob zeb diamond nplej nyob rau hauv qhov chaw thiab tswj ceev npaum li cas cov nplej "so" (hnav) thaum siv. Hom kev cog lus muaj xws li resin, hlau, vitrified, thiab electroplated (ntxiv rau qhov no hauv Cov Ntaub Ntawv Qhia Txog Kev Tshawb Fawb).
Pore Structure: Qhov sib txawv me me ntawm daim ntawv cog lus thiab cov nplej uas tso cai rau cov dej txias, tshem tawm cov nti, thiab tiv thaiv kev txhaws - qhov tseem ceeb rau kev tswj xyuas qhov tseeb hauv kev siv cua sov.

Cov yam ntxwv tseem ceeb ntawm pob zeb diamond sib tsoo log

Pob zeb diamond sib tsoo log yog txhais los ntawm cov yam ntxwv uas ua rau lawv zoo tagnrho rau cov khoom sib tw. Nov yog cov tseem ceeb tshaj plaws los xav txog:

1. Exceptional Hardness & Hnav Resistance

Pob zeb diamond nyob qib 10 ntawm Mohs hardness nplai (qhov siab tshaj plaws), txhais tau tias nws tuaj yeem zom cov ntaub ntawv nrog hardness txog 9 Mohs - suav nrog alumina ceramics, silicon carbide, iav, thiab tungsten carbide. Tsis zoo li txhuas oxide los yog silicon carbide log (uas hnav sai sai ntawm cov ntaub ntawv nyuaj), pob zeb diamond log khaws lawv cov duab thiab txiav efficiency rau 50-100x ntev, txo cov cuab yeej hloov cov nqi.

2. Precision sib tsoo muaj peev xwm

Nrog rau qhov loj me me zoo li 0.5 μm (micrometers), pob zeb diamond log ua tiav qhov kev ua tiav zoo li Ra 0.01 μm - qhov tseem ceeb rau cov khoom siv kho qhov muag, cov khoom siv hluav taws xob, thiab cov khoom siv kho mob uas txawm tias qhov tsis zoo me me ua rau tsis ua haujlwm.

3. Thaum tshav kub kub ua hauj & txias txiav

Pob zeb diamond muaj lub thermal conductivity 5x siab dua tooj liab, tso cai rau nws kom dissipate tshav kub sai heev thaum sib tsoo. Qhov no txo qis "kev puas tsuaj cua sov" (piv txwv li, tawg, kub hnyiab, lossis cov khoom siv warping) hauv cov khoom siv hluav taws xob xws li iav, quartz, thiab ceramics siab heev.

4. Customizability

Cov neeg tsim khoom tailor pob zeb diamond log rau cov kev siv tshwj xeeb los ntawm kev kho:

Grain loj (ntxhiab rau cov khoom tshem tawm sai, zoo rau kev ua tiav).
Hom Bond (resin rau cov ntawv siv hluav taws xob tsawg, hlau rau kev sib tsoo hnyav).
Lub log zoo (pav, khob, tais, lossis lub vojvoog) kom phim lub workpiece geometry.

Cov Ntaub Ntawv Qhia Txog: Yuav Ua Li Cas Pob Zeb Diamond Sib Tsoo Ua Haujlwm

Txhawm rau xaiv lub pob zeb diamond zoo, nkag siab txog nws cov kev qhia tshwj xeeb yog qhov tseem ceeb. Hauv qab no yog cov txheej txheem tseem ceeb tshaj plaws:

1. Hom Bond: Lub "Pob Txhaum" ntawm lub log

Daim ntawv cog lus txiav txim siab lub log qhov ntev, txiav ceev, thiab tsim nyog rau cov khoom sib txawv. Ntawm no yog li cas plaub hom kev cog lus tseem ceeb sib piv:

Hom Bond	Cov khoom tseem ceeb	Zoo tshaj rau
Resin Bond	Flexible, tsawg tshav kub tiam, ceev txiav. Ua kom maj mam nthuav tawm cov pob zeb diamond tshiab.	Kev ua tiav tiav (piv txwv li, iav kho qhov muag, semiconductor wafers), cov khoom ua rau thermal puas.
Hlau Bond	High hardness, hnav tsis kam, thiab rigidity. Zoo tagnrho rau hnyav Tshuag tshem tawm.	Sib tsoo cov hlau tawv (tungsten carbide), pob zeb, thiab pob zeb. Yuav tsum tau coolant los tiv thaiv overheating.
Vitrified Bond	High kub kuj, zoo heev zoo tuav, thiab tsis muaj clogging.	Precision sib tsoo ntawm ceramics, cov cuab yeej carbide, thiab bearing steel. Siv nyob rau hauv high-speed sib tsoo (HSG) tshuab.
Electroplated Bond	Nyias, tuab daim ntawv cog lus txheej nrog nthuav tawm pob zeb diamond nplej. Muab qhov siab tshaj plaws txiav efficiency.	Profiled sib tsoo (xws li, turbine hniav, pwm kab noj hniav) thiab me me-batch ntau lawm.

2. Pob zeb diamond concentration

Concentration yog hais txog tus nqi ntawm pob zeb diamond lis hauv lub log ( ntsuas li carats ib cubic centimeter). Feem ntau cov concentrations ntawm 50% mus rau 150%:

50-75%: Kev sib tsoo lub teeb (piv txwv li, iav tiav).
100%: Kev sib tsoo dav dav (piv txwv li, cov cuab yeej carbide).
125-150%: Kev sib tsoo hnyav (piv txwv li, pob zeb, pob zeb).

Cov concentration ntau dua = lub neej ntev log tab sis tus nqi siab dua.

3. Nplej Loj

Cov nplej loj yog sau los ntawm tus lej mesh (piv txwv li, 80 # = ntxhib, 1000 # = zoo) lossis micrometer (μm) loj. Txoj cai ntawm tus ntiv tes xoo:

Coarse grains (80#–220#): Kev tshem tawm sai sai (piv txwv li, shaping ceramic blocks).
Cov nplej nruab nrab (320#–600#): Kev tshem tawm thiab ua tiav (xws li sib tsoo carbide inserts).
Fine grains (800#–2000#): High-precision finishing (xws li, optical lo ntsiab muag, semiconductor wafers).

4. Lub log ceev

Pob zeb diamond log ua haujlwm ntawm qhov nrawm nrawm ( ntsuas hauv meters ib ob, m / s) txhawm rau ua kom zoo dua:

Resin daim ntawv cog lus: 20-35 m / s (tsawg mus rau nruab nrab ceev).
Hlau daim ntawv cog lus: 15-25 m / s (nruab nrab ceev, yuav tsum tau coolant).
Vitrified daim ntawv cog lus: 30-50 m / s (kev kub ceev, zoo tagnrho rau HSG).

Tshaj qhov ceev tshaj qhov pom zoo tuaj yeem ua rau lub log tawg lossis pob zeb diamond nplej kom tawg.

Qhov zoo ntawm pob zeb diamond sib tsoo log hla cov tsoos abrasives

Cov tsoos abrasive log (piv txwv li, aluminium oxide, silicon carbide) yog pheej yig dua, tab sis lawv poob qis hauv kev ua tau zoo thaum sib tsoo cov ntaub ntawv nyuaj lossis cov khoom siv precision. Nov yog vim li cas pob zeb diamond log tsim nyog rau kev nqis peev:

1. Lub neej ntev dua

Raws li tau hais ua ntej, pob zeb diamond log ntev 50-100x ntev dua li txhuas oxide log thaum sib tsoo cov ntaub ntawv nyuaj. Piv txwv li, lub log pob zeb diamond tuaj yeem sib tsoo 10,000 carbide inserts ua ntej yuav tsum tau hloov, thaum lub log aluminium oxide yuav tsuas yog 100. Qhov no txo qis lub sijhawm rau cov cuab yeej hloov pauv thiab txo cov nqi mus sij hawm ntev.

2. Kev sib tsoo ntau dua

Pob zeb diamond lub hardness tso cai rau nws txiav los ntawm cov ntaub ntawv sai dua li cov tsoos abrasives. Piv txwv li, sib tsoo 10mm-tuab alumina ceramic phaj nrog lub pob zeb diamond log yuav siv sij hawm 2-3 feeb, piv rau 10-15 feeb nrog silicon carbide log.

3. Superior Surface Quality

Cov log tsoos feem ntau tawm "kib" lossis "micro-cracks" ntawm cov ntaub ntawv nyuaj, xav tau cov kauj ruam polishing ntxiv. Pob zeb diamond log tsim ib daim iav zoo li ua tiav hauv ib qho dhau los, tshem tawm qhov xav tau ntawm kev sib tsoo tom qab thiab txuag lub sijhawm.

4. Txo cov khoom pov tseg

Precision sib tsoo nrog pob zeb diamond log minimizes "over-sib tsoo" (tshem tawm ntau tshaj li qhov tsim nyog). Qhov no yog qhov tseem ceeb rau cov khoom kim heev xws li semiconductor wafers (qhov twg ib qho wafer tuaj yeem raug nqi $ 1,000 +) lossis qib kho mob ceramics.

5. Ntau yam

Tsis zoo li cov log ib txwm muaj (uas yog txwv rau cov hlau lossis cov ntaub ntawv mos), pob zeb diamond log zom ntau yam substrates: iav, quartz, ceramics, carbide, pob zeb, pob zeb, thiab cov khoom siv hluavtaws xws li carbon fiber reinforced polymer (CFRP).

Daim ntaub ntawv: Qhov twg pob zeb diamond sib tsoo log siv

Pob zeb diamond sib tsoo log yog ib qho tseem ceeb rau kev lag luam uas xav tau precision thiab durability. Hauv qab no yog lawv cov kev siv ntau tshaj plaws:

1. Semiconductor & Electronics Kev Lag Luam

Sib tsoo silicon wafers (siv hauv microchips) kom ua tiav qhov chaw tiaj tus (± 0.5 μm flatness).
Shaping gallium arsenide (GaAs) thiab silicon carbide (SiC) substrates rau hluav taws xob hluav taws xob thiab 5G khoom siv.
Polishing LED chips los txhim kho lub teeb pom kev zoo.

2. Aerospace & Automotive

Sib tsoo turbine hniav (ua los ntawm titanium los yog Inconel) kom nruj tolerances (± 0.01 hli) rau cav efficiency.
Shaping ceramic brake discs (siv nyob rau hauv cov tsheb ua haujlwm siab) rau kev ua kom sov thiab ua haujlwm ntev.
Ua tiav cov cuab yeej carbide (siv hauv aircraft cav machining) kom muaj cov npoo ntse.

3. Optical & Kev Kho Mob Kev Lag Luam

Polishing optical lo ntsiab muag (iav los yog yas) rau lub koob yees duab, telescopes, thiab tsom iav kom ua tiav qhov chaw tsis muaj khawb.
Sib tsoo cov khoom siv kho mob (xws li, cov pob qij txha ceramic, cov pob txha titanium) kom ua tau raws li cov qauv biocompatibility thiab haum haum.
Shaping quartz crucibles (siv nyob rau hauv semiconductor manufacturing) los tuav molten silicon.

4. Kev tsim kho & pob zeb ua

Sib tsoo pob zeb hauv pem teb los ua kom du, theem saum npoo rau cov tsev lag luam.
Shaping ntuj pob zeb (marble, granite) rau countertops, vuas, thiab monuments.
Polishing engineered pob zeb (xws li, quartzite) los txhim kho nws txoj kev zoo nkauj.

5. cuab yeej & Tuag Manufacturing

Sharpening carbide kawg mills, xyaum, thiab xuas nrig ntaus cov cuab yeej los kho cov kev ua haujlwm txiav.
Sib tsoo pwm kab noj hniav (siv rau hauv cov yas txhaj tshuaj molding) kom meej cov duab thiab nto tiav.

Yuav ua li cas xaiv lub pob zeb diamond sib tsoo log

Xaiv lub log kom raug yog nyob ntawm peb yam:

Cov Khoom Siv Ua Haujlwm: Xaiv hom kev sib cog lus uas phim cov khoom hardness (piv txwv li, hlau daim ntawv cog lus rau carbide, resin daim ntawv cog lus rau iav).
Lub Hom Phiaj Sib Tsoo: Coarse grain rau kev tshem tawm cov khoom, nplua nplej rau kev ua tiav.
Tshuab Compatibility: Xyuas kom lub log ceev thiab qhov loj me phim koj lub tshuab sib tsoo cov lus qhia.

Piv txwv li:

Yog tias koj tab tom sib tsoo silicon wafer (mos, kub-sensitive), lub log log nrog 1000 # nplej yog qhov zoo tagnrho.
Yog tias koj tab tom tsim lub cuab yeej tungsten carbide (nyuaj, ua haujlwm hnyav), lub log hlau nrog 220 # nplej ua haujlwm zoo tshaj.

Post lub sij hawm: Aug-31-2025